Infineon Technologies ( Infineon Technologies ) announced in Austria Villach ( Villach ) stronghold to produce the first 300mm ( 12 inch ) thin wafer of power semiconductor chip ( first silicon ), to become the world’s first successful use of this technology, the company further. Using 300mm thin wafer production of chip function characteristics, and to 200mm wafer fabrication of power semiconductor, has been successfully adopted in high pressure applications using metal oxide semiconductor field effect transistor ( MOSFET ) application test.

　　The invention of the transistor in 55 years, Ying Feiling to revolutionary CoolMOS transistor technology, won the 2002 German Industrial Innovation Awards ( German Industry ’ s Innovation Award ). High voltage transistor, in many application fields enhance energy efficiency, such as PC power supply device, server, solar power converter, lighting and electrical system. These energy-saving chip is currently the consumer electronic device necessary elements, such as planar TV and games. The use of energy, energy saving and without loss of efficiency, has become all the electricity industry and the application of the primary needs of family. Infineon energy-saving semiconductor solutions, can save up to 25% of worldwide electricity consumption of high.

　　In 2010 October, Ying Feiling in Austria Villach setting up 300 mm wafer and thin wafer technology power semiconductor pilot production line. The team has 50 engineers and physicists, from research, development, manufacturing and marketing fields. The first 300 mm wafer is offline, Ying Feiling continued success in manufacturing energy-saving products for power semiconductor pusher. According to the IMS Research introduced in August this year research report in 2010, Ying Feiling still ranks of global semiconductor market leader, and has been for eighth consecutive years to obtain this special honour.